Si based print circuit board fabricated by si deep etching and metal powder injection molding

Proceedings of SPIE- The International Society for Optical Engineering

Volumn 4235, Issue , 2001, Pages 209-216

  Maeda, Ryutaro ^a   Murakoshi, Yoichi ^b   Shimizu, Toru ^a   Li, Yaomin ^c   Takizawa, Hiroyuki ^c  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c Tokyo Cathode Laboratory Co Ltd   (Japan)

Author keywords

ICP; Metal injection; Micromachining; Print circuit board; Si deep etching; Through hole

Indexed keywords

BINDERS; ETCHING; INJECTION MOLDING; POWDER METALS; SILICON WAFERS; SINTERING;

METAL INJECTION; SILICON DEEP ETCHING;

PRINTED CIRCUIT BOARDS;

EID: 0034980006     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.420860     Document Type: Article

References (1)

1. Design, test, and microfabrication of MEMS and MOEMS