Planarization of deep trenches

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4557, Issue , 2001, Pages 49-57

  Rusu, Cristina ^a   Klaasse, Gerard ^a   Sedky, Sherif ^a   Esch, Heleen ^a   Parmentier, Brigitte ^a   Verbist, Agnes ^a   Witvrouw, Ann ^a  

^a IMEC   (Belgium)

Author keywords

Deep trench; Deposition; LPCVD; PECVD; Planarization; Polymer dielectric

Indexed keywords

OXIDATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMAS; POLYIMIDES; SPIN COATING;

PLANARIZATION;

ETCHING;

EID: 0035763952     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.442970     Document Type: Conference Paper

References (9)

1. P. Chiniwalla et al., Multilayer planarization of polymer dielectrics, IEEE Transaction on Advanced Packaging, 24 (1), p.41-53, 2001.
2. A. Partridge et al., New Thin Film Epitaxial Polysilicon Encapsulation for Piezoresistive Accelerometers, Proc. MEMS '01, Interlaken, Switzerland, p.54-59, 2001.
3. W. Geiger et al., New designs of micromachined vibrating rate gyroscopes with decoupled oscillation modes, Proc. Transducers '97, Chicago, USA, p.1129, 1997.
4. C. Liu, Y.-C. Tai, Sealing of micromachined cavities using chemical vapour deposition methods: Characterisation and optimisation, JMEMS 8 (2), p.135-145, 1999.
5. D.L. Simpson et al., Planarization Processes and Applications I. Undoped GeO2-SiO2 Glasses, J. Electrochem. Soc. 146(10) p.3860-3871, 1999.
6. H. Jansen at al., Micromachined devices for space telecom applications, Proc. 3rd Round Table on Micro/Nano-Technologies for Space. ESA, p. 135-140, 15-17 May 2000; Noordwijk, The Netherlands.
7. A.E. Franke et al., Post-CMOS Integration of Germanium Microstructures, Proc. MEMS '99, Orlando, Florida, USA, p.630-637, 1999.
8. S. Restani et al., J. Electrochem. Soc. 137, p. 1288, 1990.
9. B. Du Bois et al., HF etching of Si-oxides and Si-nitrides for surface micromachining, Proc. Dutch National Sensor Conference, Enschede, the Netherlands, May 2001.