Improving the process capability of SU-8, part II

Journal of Photopolymer Science and Technology

Volumn 14, Issue 5, 2001, Pages 689-694

  Johnson, D W ^a   Jeffries, A ^a   Minsek, D W ^a   Hurditch, R J ^a  

^a MicroChem Corp   (United States)

Author keywords

Dielectric resist; Epoxy modified resist; Stress reduction; SU 8 resist

Indexed keywords

4,4' ISOPROPYLIDENEDIPHENOL; ALIPHATIC COMPOUND; COPOLYMER; EPOXY RESIN; FORMALDEHYDE; PHENOL; POLYOL; SILOXANE; URETHAN;

ARTICLE; DIELECTRIC CONSTANT; FILM; HARDNESS; HEAT STRESS; MATERIAL COATING; PHOTOCHEMISTRY;

EID: 0035747135     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.14.689     Document Type: Article

References (15)