Barrier layer effect of titanium-tungsten on the electromigration in sputtered copper films on polyimide

Journal of Materials Science: Materials in Electronics

Volumn 11, Issue 1, 2000, Pages 17-24

  Wang, Hsueh Wen ^a   Chiou, Bi Shiou ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPOSITION EFFECTS; COPPER; DIFFUSION IN SOLIDS; ELECTROMIGRATION; METALLIZING; METALLOGRAPHIC MICROSTRUCTURE; POLYIMIDES; SPUTTERING; TITANIUM ALLOYS;

TITANIUM TUNGSTEN ALLOYS;

METALLIC FILMS;

EID: 0033896807     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008995902371     Document Type: Article

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