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Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 19, Issue 6, 2001, Pages 2974-2978

Chemical vapor deposition of an electroplating Cu seed layer using hexafluoroacetylacetonate Cu(1,5-dimethylcyclooctadiene)

(8) Lee, W H a Ko, Y K a Byun, I J a Seo, B S a Lee, J G a Reucroft, P J b Lee, J U c Lee, J Y c

a Kookmin University (South Korea)

b UNIVERSITY OF KENTUCKY (United States)

c Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; COPPER; ELECTRIC CONDUCTIVITY; ELECTROPLATING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; NUCLEATION; REFLECTION; SCANNING ELECTRON MICROSCOPY; SUPERCONDUCTING TRANSITION TEMPERATURE; SURFACE ROUGHNESS; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY;

SEED LAYERS;

METALLIC FILMS;

EID: 0035509139 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.1405511 Document Type: Article

Times cited : (15)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.