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Volumn 11, Issue 6, 2001, Pages 623-629

A versatile and modularizable micromachining process for the fabrication of thermal microsensors and microactuators

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; CRYSTAL MICROSTRUCTURE; FOUNDRIES; LAYERED MANUFACTURING; MICROACTUATORS; MICROMACHINING; POROUS SILICON; STRENGTH OF MATERIALS; THERMAL INSULATION;

EID: 0035505196     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/6/302     Document Type: Article
Times cited : (13)

References (23)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.