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Volumn 11, Issue 6, 2001, Pages 623-629
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A versatile and modularizable micromachining process for the fabrication of thermal microsensors and microactuators
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Author keywords
[No Author keywords available]
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Indexed keywords
CMOS INTEGRATED CIRCUITS;
CRYSTAL MICROSTRUCTURE;
FOUNDRIES;
LAYERED MANUFACTURING;
MICROACTUATORS;
MICROMACHINING;
POROUS SILICON;
STRENGTH OF MATERIALS;
THERMAL INSULATION;
SILICON FOUNDRIES;
MICROSENSORS;
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EID: 0035505196
PISSN: 09601317
EISSN: None
Source Type: Journal
DOI: 10.1088/0960-1317/11/6/302 Document Type: Article |
Times cited : (13)
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References (23)
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