Design tool for evaluating low cycle solder fatigue of SMT interconnections

TMS Annual Meeting

Volumn , Issue , 1997, Pages 305-316

  Carper, Ted ^a   Viswanadham, Puligandla ^a   Mayr, Robert Von ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE (MECHANICAL); FATIGUE OF MATERIALS; SURFACE MOUNT TECHNOLOGY; THERMAL EXPANSION;

LOW CYCLE SOLDER FATIGUE;

SOLDERED JOINTS;

EID: 0031336257     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)