Three dimensional metallization for vertically integrated circuits

Vide: Science, Technique et Applications

Volumn 53, Issue 283 SUPPL., 1997, Pages 94-98

  Bollmann, D ^a   Braun, R ^a   Buchner, R ^a   Cao Minh, U ^a   Engelhardt, M ^b   Errmann, G ^a   Grassl T ^a   Hieber, K ^a   Hubner H ^b   Kawala, G ^a   Kleiner, M ^b   Klumpp, A ^a   Kuhn S ^b   Landesberger, C ^a   Lezec, H ^c   Muth, W ^a   Pamler, W ^b   Popp, R ^a   Renner, E ^b   Ruhl, G ^a   Sanger A ^b   Scheler, U ^b   Schmidt, C ^b   Schwarzl, S ^b   Weber, J ^a   Weber, W ^b   Ramm, P ^a   more..

^a Fraunhofer Institut fur Festkorpertechnologie   (Germany)

^b SIEMENS AG   (Germany)

^c Micrion Europe   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 20544449462     PISSN: 12660167     EISSN: None     Source Type: Journal    
DOI: 10.1109/mam.1997.621072     Document Type: Article

References (4)

1. Hayashi, et al., 1990 Symp. VLSI Tech., p. 95
2. Ramm, et al., US patent 5,563,084, 1995
3. Kleiner, et al., IEDM Tech. Digest, p. 487, 1995
4. Kleiner, et al., IEEE Trans. Comp., Packag., Manufact. Technol., vol. 19, no. 4, p. 719, 1996