Electroplating technology for copper interconnection in ULSI

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 22, Issue 8, 2001, Pages 1093-1096

  Zhang, Guo Hai ^a   Qian, He ^a   Xia, Yang ^a   Wang, Wen Quan ^a   Long, Shi Bing ^a  

^a INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

Copper interconnection; Electroplating; Integrated circuits

Indexed keywords

ASPECT RATIO; COPPER; ELECTROPLATING; LARGE SCALE SYSTEMS;

COPPER INTERCONNECTION; ELECTROMIGRATION RESISTANCE;

VLSI CIRCUITS;

EID: 0035436269     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)