Ohmic contact performance between Ti/Al/Ti/Au and AlGaN

Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors

Volumn 22, Issue 6, 2001, Pages 737-740

  Zhang, Jin Wen ^a   Zhang, Tai Ping ^a   Wang, Wei ^a   Ning, Bao Jun ^a   Wu, Guo Ying ^a  

^a PEKING UNIVERSITY   (China)

Author keywords

AlGaN; Ohmic contact; Ti Al Ti Au

Indexed keywords

ANNEALING; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GALLIUM COMPOUNDS; SPUTTER DEPOSITION; TITANIUM ALLOYS;

CONTACT RESISTIVITY; RAPID THERMAL ANNEALING;

OHMIC CONTACTS;

EID: 0035382057     PISSN: 02534177     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)