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Volumn 30, Issue 4, 2001, Pages 284-289
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Evaluation of ultra-low-k dielectric materials for advanced interconnects
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Author keywords
Dielectric; Integration; Interconnect; Low k; Porosity; Porous low k; Sol gel; Thermal conductivity; Young's modulus
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Indexed keywords
CROSSTALK;
DEPOSITION;
ELASTIC MODULI;
INTEGRATED CIRCUITS;
PERMITTIVITY;
POROSITY;
SOL-GELS;
THERMAL CONDUCTIVITY;
POROUS DIELECTRIC FILM DEPOSITION;
DIELECTRIC FILMS;
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EID: 0035306499
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-001-0032-0 Document Type: Article |
Times cited : (62)
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References (17)
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