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Volumn 30, Issue 4, 2001, Pages 284-289

Evaluation of ultra-low-k dielectric materials for advanced interconnects

Author keywords

Dielectric; Integration; Interconnect; Low k; Porosity; Porous low k; Sol gel; Thermal conductivity; Young's modulus

Indexed keywords

CROSSTALK; DEPOSITION; ELASTIC MODULI; INTEGRATED CIRCUITS; PERMITTIVITY; POROSITY; SOL-GELS; THERMAL CONDUCTIVITY;

EID: 0035306499     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0032-0     Document Type: Article
Times cited : (62)

References (17)
  • 7
    • 0002573236 scopus 로고    scopus 로고
    • Piscataway, NJ: IEEE
    • E.S. Moyer et al., Proc. IITC (Piscataway, NJ: IEEE, 1999), p. 196.
    • (1999) Proc. IITC , pp. 196
    • Moyer, E.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.