Finite element analysis of plastic-encapsulated Multi-Chip Packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 1998, Pages 170-176

  Tay, A A O ^a   Ong, S H ^a   Lee, L W ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ENCAPSULATION; FINITE ELEMENT METHOD; MULTICHIP MODULES; PLASTIC MOLDS; RESIDUAL STRESSES; STRESS CONCENTRATION;

PLASTIC-ENCAPSULATED MULTICHIP PACKAGES (MCP);

ELECTRONICS PACKAGING;

EID: 0032230468     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (20)