Characterization of warpage of flip-chip PBGA package and its effect on solder joint reliability

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 253-258

  Park, Seungbae ^a   Han, Bongtae ^a   Verma, Kaushal ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETRY; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERED JOINTS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; SURFACE TOPOGRAPHY;

FAR INFRARED FIZEAU INTERFEROMETRY; FLIP CHIP PLASTIC BALL GRID ARRAY PACKAGE; SOLDER BALL RELIABILITY; WARPAGE;

ELECTRONICS PACKAGING;

EID: 0033309909     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)