Low temperature metal-organic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 17, Issue 3, 1999, Pages 1101-1104

  Kelsey, Jean E ^a  

^a STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 22644450444     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.590703     Document Type: Article

References (8)

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