Low temperature copper etching using an inductively coupled plasma with ultraviolet light irradiation

Journal of the Electrochemical Society

Volumn 145, Issue 3, 1998, Pages

  Choi, Kang Sik ^a,b   Han, Chul Hi ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER COMPOUNDS; DESORPTION; PLASMA ETCHING; REACTION KINETICS; ULTRAVIOLET RADIATION;

INDUCTIVELY COUPLED PLASMA;

COPPER;

EID: 0032026142     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1838333     Document Type: Article

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