Improving corrosion-resistance of silicon-glass micropackages using boron doping and/or self-induced galvanic bias

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 2001, Pages 112-119

  Stark, B H ^a   Dokmeci, M R ^a   Harpster, T J ^a   Najafi, K ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Corrosion resistance; Micropackage; Polysilicon dissolution

Indexed keywords

CORROSION RESISTANCE; DEPOSITION; DISSOLUTION; HERMETIC SEALS; POLYSILICON; SEMICONDUCTING BORON; SEMICONDUCTING GLASS; SEMICONDUCTING SILICON; SEMICONDUCTOR DOPING; SILICA; SILICON NITRIDE; STOICHIOMETRY;

CORROSION REDUCTION; SALINE SOAK TEST; SELF INDUCED GALVANIC BIAS; SILICON GLASSMICROPACKAGES;

ELECTRONICS PACKAGING;

EID: 0035009644     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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