High performance flip-chip technique for wide-band modules

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1996, Pages 207-209

  Iwasaki, Noboru ^a   Ishitsuka, Fuminori ^a   Kato, Kazutoshi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LINES; ELECTRIC LOSSES; FINITE ELEMENT METHOD; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; OPTIMIZATION; PERFORMANCE; WAVEGUIDES;

CAPACITIVE COUPLING; COPLANAR WAVEGUIDES; WIDE BAND MODULES;

FLIP CHIP DEVICES;

EID: 0030385209     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)