Underfilled BGAs for a variety of plastic BGA package types and the impact on board-level reliability

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1045-1051

  Burnette, T ^a   Johnson, Z ^a   Koschmieder, T ^a   Oyler, W ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; MATHEMATICAL MODELS; OPTIMIZATION; RELIABILITY; THERMAL EXPANSION;

BALL GRID ARRAY; MOLD ARRAY PROCESS;

ELECTRONICS PACKAGING;

EID: 0034836020     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927944     Document Type: Article

References (18)

1. Underfilling BGA for harsh environment deployment
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10. Implementation of and extensions to darveaux's approach to finite-element simulation of BGA solder joint reliability
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12. Materials mechanisms and mechanical reliability of flip chip assemblies on organic substrates
13. Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
14. Measurements of solder bump lifetime as a function of underfill material properties
15. The effects of underfill on the reliability of flip chip solder joints
16. Coffin-Manson fatigue model of underfilled flip-chips