Underfilling BGA for harsh environment deployment

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3830, Issue , 1999, Pages 409-413

  Young, Steven J ^a  

^a GENERAL DYNAMICS ADVANCED INFORMATION SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVIONICS; FATIGUE OF MATERIALS; HEAT SINKS; INTEGRATED CIRCUITS; MILITARY APPLICATIONS; SOLDERED JOINTS; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAY; CHIP SIZE PACKAGE; COMPOSITE HEATSINK; INTEGRATED CIRCUIT PACKAGES; MILITARY AVIONICS; UNDERFILL;

ELECTRONICS PACKAGING;

EID: 0033363539     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)