SCOPUS 정보 검색 플랫폼

IEEE International Symposium on Electronics and the Environment

Volumn , Issue , 2000, Pages 46-53

Examining the environmental impact of lead-free soldering alternatives

(5) Turbini, Laura J a Munie, Gregory C b Bernier, Dennis c Gamalski, Jürgen d Bergman, David W e

a Centre for Microelectronics Assembly and Packaging (Canada)

b NOKIA RESEARCH CENTER (United States)

c Kester Solder (United States)

d SIEMENS AG (Germany)

e IPC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ECOLOGY; ELECTRONIC EQUIPMENT; ENVIRONMENTAL IMPACT; LEAD; LIFE CYCLE; RECYCLING;

END OF LIFE; LEAD FREE SOLDERING;

SOLDERING;

EID: 0034446733 PISSN: None EISSN: None Source Type: Journal
DOI: 10.1109/6104.924786 Document Type: Article

Times cited : (10)

References (31)

1
- 85003523011
- note

2
- 85003502051
- Proposal for a directive on waste from electric and electronic equipment 76/769/EEC
- Third Draft, European Commission Directorate General XI: Brussels, July 5, 1999

3
- 85003646367
- Japanese Electronic Industry Development Association

4
- 0003736709
- Prentice Hall, Englewood Cliffs, NJ
- (1999) Industrial Ecology: Policy Framework and Implementation
- Allenby, R.B.¹

5
- 0001780985
- An assessment of the use of lead in electronic assembly
- Proceedings of Surface Mount International, San Jose, CA, 1992 , pp. 1-28
- Allenby, B.R.¹

6
- 0005063021
- Improved design life & environmentally aware manufacturing of electronic assemblies by lead-free soldering - IDEALS
- Project Funded by the European Community under the BRITE-EURAM Program, Project No. BE95-1994, Contract No. BRPR-CT96-0140

7
- 85003726618
- Alternative solders for electronic assembly
- Department of Trade and Industry (DTI) - Sponsored Project 1991-1993 undertaken by GEC-Marconi, ITRI, BNR Europe, Multicore Solders, Ltd., Final Report MS/20073, issued October 26, 2993

8
- 84866826487
- Lead free soldering - an analysis of the current status of lead-free soldering
- DTI Publication No. DTI/Pub/4066/10k/4/99/NP

9
- 4243280717
- Lead-free solder research
- Multi-client Program, Swedish Institute for Production Engineering Research (IVF)
- (1997)

10
- 4243327569
- Lead-free solder alternatives
- Report on a four-year collaborative project by the National Center for Manufacturing Sciences (NCMS), January
- (1998)

11
- 0001944432
- Environmental issues in electronics and the transition to lead-free soldering
- Proceedings of SMTA International, San Jose, CA, 1999 , pp. 371-377
- Nimmo, K.¹

12
- 0003345323
- Junked PC's a growing environmental problem
- August 8
- (1999) Atlanta Journal Constitution
- Lowy, J.¹

13
- 0003709943
- Publication No. OTA-E-541
- Green Products by Design, Choices for a Cleaner Environment

14
- 84992978449
- World Commission on Environment and Development
- (1987) Our Common Future

15
- 0004113893
- ed. R. H. Socolow, MIT Press
- (1992) Industrial Ecology and Global Changes

16
- 0004121743
- Prentice Hall, Englewood Cliffs, NJ
- (1995) Industrial Ecology
- Graedel, T.E.¹ Allenby, B.R.²

17
- 0004251547
- Prentice Hall, Upper Saddle River, NJ
- (1998) Industrial Ecology and the Automobile
- Graedel, T.E.¹ Allenby, B.R.²

18
- 0032691904
- Lead-free soldering - where the world is going
- September/October
- (1999) Advancing Microelectronics , pp. 29
- Lee, N.-C.¹

19
- 0003455830
- Lead-free solder: No longer a paper tiger
- report prepared by Prismark Partners, February
- (1999)

20
- 0003628693
- IPC roadmap for lead-free electronic assemblies
- November
- (1999)

21
- 0005083548
- Impact of higher melting lead-free solders on reliability of printed wiring assemblies
- Surface Mount Technology
- Turbini, L.J.¹ Bent, W.R.² Ready, W.J.³

22
- 0000182493
- Method 1311 toxicity characteristic leaching procedure (TPLP)
- March 29
- (1990) Federal Register , vol.55 , Issue.61 , pp. 11863-11877

23
- 0002435823
- Are lead-free solders really environmentally friendly?
- March
- (1999) SMT , pp. 64-66
- Smith, E.B.¹ Swanger, K.²

24
- 0033154038
- Environmental impact of lead-free solders
- July
- (1999) SMT , pp. 74-79
- Smith, E.¹ Swanger, K.²

25
- 0027607441
- The environmental threats of discarded picture tubes and printed circuit boards
- (1993) J. Hazardous Materials , vol.34 , Issue.2 , pp. 235-243
- Yang, G.C.¹

26
- 4243393863
- Summary of data on municipal solid waste landfill leachate characteristics
- prepared for the U.S. EPA
- (1988)

27
- 4243280626
- Potential human exposures from lead in municipal solid waste
- a report prepared for the Lead Industries Association by Industrial Economics, Inc. (IEC), May 21
- (1991)

28
- 85003572912
- Case studies on groundwater and surface water contamination from municipal solid waste landfills
- prepared for the U.S. EPA
- (1988)

29
- 0343791988
- Municipal waste combustion study: Assessment of health risks associated with municipal waste combustion processes
- prepared for the U.S. EPA
- (1987)

30
- 4243456827
- Baseline risk analysis to support municipal waste combustor new source performance standard and emission guideline development
- memorandum from R. M. Morrison, U.S. EPA, Nov. 22
- (1989)

31
- 0003262996
- Damage claims fly over cyanide spill
- Feb. 15
- (2000) Atlanta Journal Constitution
- Gec, J.¹

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