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Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999

Volumn , Issue , 1999, Pages 620-625

Interface phenomena in lead-free soldering

(1) Suganuma, K a

a OSAKA UNIVERSITY (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYS; BINARY ALLOYS; COPPER ALLOYS; COPPER COMPOUNDS; HEAT RESISTANCE; INTERMETALLICS; LEAD-FREE SOLDERS; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; SILVER ALLOYS; SOLDERING; SOLDERING ALLOYS; TERNARY ALLOYS; TIN; TIN ALLOYS; ZINC; ZINC ALLOYS; ZIRCONIUM ALLOYS;

EUTECTIC ALLOYS; INDUSTRIAL FIELDS; INTERFACE PHENOMENA; LEAD-FREE SOLDERING; RAPID COOLING; REACTION LAYERS; SOLDERING TEMPERATURE; TECHNOLOGICAL DEVELOPMENT;

BISMUTH ALLOYS;

EID: 84966516466 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ECODIM.1999.747687 Document Type: Conference Paper

Times cited : (4)

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