Evaluation of Pb-free solders for adaptability to various soldering processes

Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999

Volumn , Issue , 1999, Pages 610-614

  Tsunematsu, Y ^a   Tanigami, M ^a   Hirano, M ^a  

^a OMRON CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; EFFICIENCY; HEAT RESISTANCE; IRON; LEAD; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; SILVER; SILVER ALLOYS; SOLDERING; TERNARY ALLOYS; TIN; TIN ALLOYS;

MACHINE SOLDERING; QUALITY OF PRODUCT; SMT PROCESS; SN-AG-CU; SNAGCU SOLDER; SOLDERING PROCESS;

SOLDERING ALLOYS;

EID: 85035317009     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.1999.747685     Document Type: Conference Paper

References (1)

1. The welfare ministry, http: //www. miti. po. jp. /pressj/environment/s80313. 3al. ht.