Thermal fatigue damage of quad flat pack leads and Sn-3.5Ag-X (X=Bi and Cu) solder joints

Proceedings - 1st International Symposium on Environmentally Conscious Design and Inverse Manufacturing, EcoDesign 1999

Volumn , Issue , 1999, Pages 626-631

  Warashina, K ^a   Kariya, Y ^a   Hirata, Y ^a   Otsuka, M ^a  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; BISMUTH; COPPER ALLOYS; FATIGUE DAMAGE; FATIGUE OF MATERIALS; ISOTHERMS; LEAD; LEAD ALLOYS; MANUFACTURE; MECHANICAL VARIABLES MEASUREMENT; SILVER; SILVER ALLOYS; TERNARY ALLOYS; THERMAL FATIGUE; TIN ALLOYS;

BULK SOLDER; ISOTHERMAL FATIGUE; METALLOGRAPHIC EXAMINATION; PULL STRENGTH; QUAD FLAT PACKS; SN-3.5AG SOLDERS; SOLDER JOINTS; THERMAL FATIGUE CRACKS;

TIN;

EID: 85009855015     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECODIM.1999.747688     Document Type: Conference Paper

References (5)

1. D. Napp, SAMPE Journal, 32, 2, 1996, p59-65.
2. W. Engelmarier, Solder Joint Reliability, Van Norstrand Reinhold, ed. J. H. Lau, 1991, p572.
3. Y. Kariya and M. Otsuka, Journal of Electronic Materials, Vol. 27 7 (1998), p866-868.
4. Y. Kariya and M. Otsuka, Journal of Electronic Materials, Vol. 27, 7 (1998), p1229.
5. Y. Kariya andM. Otsuka, Proc. IMMM'97, Aug. 6-8. 1997.