Mechanical and microstructural characteristics of dilute SnBi and SnBiIn alloys

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 170-174

  Reinikainen, T ^a   Kivalahti, J K ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; INTERFACES (MATERIALS); PACKAGING MATERIALS; SOLDERING ALLOYS; STRAIN RATE; TEMPERATURE; TERNARY ALLOYS; TIN ALLOYS; BISMUTH; BONDING; COMPOSITION EFFECTS; INDIUM; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; SOLID SOLUTIONS; THERMAL CYCLING; THERMAL EFFECTS; THERMOANALYSIS;

CYCLING TEMPERATURES; EQUILIBRIUM STRUCTURES; MICRO-STRUCTURAL CHARACTERISTICS; NOMINAL COMPOSITION; SOLDER JOINTS; TEMPERATURE CYCLING; TEMPERATURE RANGE; THERMODYNAMIC ASSESSMENT;

BISMUTH ALLOYS; TIN ALLOYS;

TIN BISMUTH ALLOYS; TIN BISMUTH INDIUM ALLOYS; TRANSFUSION BONDING;

EID: 0032230671     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664456     Document Type: Conference Paper

References (11)

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