The novel evaluation for extremely thin TaNx films as a copper barrier

Advanced Metallization Conference (AMC)

Volumn , Issue , 2000, Pages 329-335

  Min, Woo Sig ^a   Pyo, Sung Gyu ^a   Kim, Heon Do ^a   Kim, Sibum ^a   Lee, Tae Kwon ^a   Park, Heung Lak ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL DEFECTS; DIFFUSION; GRAIN BOUNDARIES; IONIZATION OF SOLIDS; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; TANTALUM COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

INTERLAYER DIELECTRICS (ILD);

THIN FILMS;

EID: 0034459668     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)