Reliability of commercial plastic encapsulated microelectronics at temperatures from 125°C to 300°C

IEEE Aerospace Conference Proceedings

Volumn 5, Issue , 2000, Pages 445-450

  McCluskey, P ^a   Mensah, K ^a   O'Connor, C ^a   Lilie, F ^a   Gallo, A ^a   Fink, J ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOBILE ELECTRONIC EQUIPMENT; AVIONICS; ELECTRONICS PACKAGING; MICROCONTROLLERS; RELIABILITY; SERVICE LIFE; THERMAL EFFECTS;

INSULATION RESISTANCE DEGRADATION; PLASTIC ENCAPSULATED MICROELECTRONICS;

MICROELECTRONICS;

EID: 0034432106     PISSN: 1095323X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Molding compounds technology for military applications
2. Effect of high thermal stability mold material on the gold-aluminum bond reliability in epoxy encapsulated VLSI devices
3. Some aspects of the growth of diffusion layers in binary systems
4. Packaging of electronics for high temperature applications
5. Design limits when using gold-aluminum bonds
6. Purple plague revisited
7. PGA for high power: Extending the thermal envelope
8. Non halogen/antimony flame retardant system for high end IC package
9. Engineering dielectrics