Non halogen/antimony flame retardant system for high end IC package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1248-1253

  Yamaguchi, Miho ^a   Shigyo, Hitomi ^a   Yamamoto, Yuko ^a   Sudo, Shinichiro ^a   Ito, Satoshi ^a  

^a NITTO DENKO CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIMONY COMPOUNDS; ELECTRONICS PACKAGING; HALOGEN COMPOUNDS; PLASTICS APPLICATIONS; SHEET MOLDING COMPOUNDS;

ANTIMONY OXIDE; BALL GRID ARRAY; PLASTIC ENCAPSULATED PACKAGES;

FLAME RETARDANTS;

EID: 0030648156     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)