Packaging of electronics for high temperature applications

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 3, 1997, Pages 409-422

  McCluskey, Patrick ^a,f,g   Das, Diganta ^a,h,i,j   Jordan, Jill ^a,c,j,k,l   Grzybowski, Richard R ^b   Fink, John ^c   Condra, Lloyd ^a,d,f,g,m,n   Torri, Thomas C ^e,o,p  

^a UNIVERSITY OF MARYLAND   (United States)

^b UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

^c HONEYWELL   (United States)

^d BOEING COMPANY   (United States)

^e DELPHI CORPORATION   (United States)

^f LEHIGH UNIVERSITY   (United States)

^g IEEE

^h MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

ⁱ INDIAN INSTITUTE OF TECHNOLOGY   (India)

^j ASME   (Germany)

^k UNIVERSITY OF MARYLAND   (United States)

^l NORTHROP GRUMMAN CORPORATION   (United States)

^m LUCENT TECHNOLOGIES   (United States)

ⁿ IOWA STATE UNIVERSITY   (United States)

^o UNIVERSITY OF NOTRE DAME   (United States)

^p UNIVERSITY OF MICHIGAN   (United States)

more..

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003367919     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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