EFFECT OF HIGH THERMAL STABILITY MOLD MATERIAL ON THE GOLD-ALUMINUM BOND RELIABILITY IN EPOXY ENCAPSULATED VLSI DEVICES.

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1988, Pages 40-49

  Khan, Muhib ^a   Fatemi, Homi ^a   Romero, Jeremias ^a   Delenia, Eugene ^a  

^a ADVANCED MICRO DEVICES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION - PLASTICS APPLICATIONS;

EPOXY ENCAPULATED VLSI; GOLD-ALUMINUM BOND RELIABILITY; HIGH THERMAL STABILITY MOLD MATERIAL;

INTEGRATED CIRCUITS, VLSI;

EID: 0023854641     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/irps.1988.362198     Document Type: Conference Paper

References (9)