Thermal and electromigration strain distributions in 10 μm-wide aluminum conductor lines measured by x-ray microdiffraction

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 273-278

  Wang, P C ^a   Cargill III, G S ^a   Noyan, I C ^a   Liniger, E G ^a   Hu, C K ^a   Lee, K Y ^a  

^a Och Spine at New York Presbyterian Hospitals   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; ANODES; ELECTROMIGRATION; PASSIVATION; STRAIN MEASUREMENT; STRESS RELAXATION; THERMAL EXPANSION; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

STRESS GRADIENTS; X RAY MICRODIFFRACTION;

THIN FILMS;

EID: 0031338289     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-273     Document Type: Conference Paper

References (21)