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Volumn 18, Issue 4, 2000, Pages 1942-1948

Ion-bombardment effects on PtSi/ n-Si Schottky contacts studied by ballistic electron emission microscopy

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; DEEP LEVEL TRANSIENT SPECTROSCOPY; ION BOMBARDMENT; MICROSCOPIC EXAMINATION; REACTIVE ION ETCHING; SEMICONDUCTING SILICON COMPOUNDS;

EID: 0034412470     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (1)

References (22)
  • 19
    • 0343550709 scopus 로고
    • edited by S. M. Sze McGraw-Hill, Auckland
    • T. E. Seidel, in VLSI Technology, edited by S. M. Sze (McGraw-Hill, Auckland, 1983), p. 237.
    • (1983) VLSI Technology , pp. 237
    • Seidel, T.E.1
  • 21
    • 0003400638 scopus 로고
    • Wiley, New York, For example, sputtering yield of Ar on Si is 0.31 at 300 eV, which leads to an etch rate of 4 Å/s
    • B. Chapman, Glow Discharge Processes: Sputtering and Plasma Etching (Wiley, New York, 1980), p. 395. For example, sputtering yield of Ar on Si is 0.31 at 300 eV, which leads to an etch rate of 4 Å/s.
    • (1980) Glow Discharge Processes: Sputtering and Plasma Etching , pp. 395
    • Chapman, B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.