Temperature-driven power and timing analysis for CMOS ULSI circuits

Proceedings - IEEE International Symposium on Circuits and Systems

Volumn 6, Issue , 1999, Pages

  Cheng, Yi Kan ^a   Kang, Sung Mo ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

POWER DENSITY ESTIMATION; TEMPERATURE-DEPENDENT TIMING ANALYSIS;

CMOS INTEGRATED CIRCUITS; COMPUTER SIMULATION; INTEGRATED CIRCUIT LAYOUT; MONTE CARLO METHODS;

ULSI CIRCUITS;

EID: 0032633639     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (7)

1. C. C. Teng, Y. K. Cheng, E. Rosenbaum, and S. M. Kang, "iTEM: A new electromigration (EM) reliability diagnosis tool using electrothermal timing simulation," in Proceedings of the IEEE International Reliability Physics Symposium, Apr. 1996, pp. 172-179.
2. A. M. Hill, "Switching density analysis for power and reliability in VLSI circuits," Ph.D. dissertation, Dept. of Electrical and Computer Engineering, University of Illinois, Urbana, IL, 1996.
3. Y. K. Cheng, P. Raha, C. C. Teng, E. Rosenbaum, and S. M. Kang, "ILLIADS-T: An electrothermal simulator for thermal reliability diagnosis of CMOS VLSI chips," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 17, no. 8, Aug 1998.
4. M. G. Xakellis and F. N. Najm, "Statistical estimation of the switching activity in digital circuits," in Proceedings of the ACM/IEEE Design Automation Conference, pp. 728-733, June 1994.
5. I. Miller and J. E. Freund, Probability and Statistics for Engineers. Englewood Cliffs, NJ: 3rd ed. Prentice-Hall, 1985.
6. Y. H. Shih and S. M. Kang, "Analytic transient solution of general MOS circuit primitives," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 11, pp. 719-731, June 1992.
7. J. T. Kong and D. Overhauser, "Methods to improve digital MOS macromodel accuracy," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 14, pp. 868-881, July 1995.