-
1
-
-
0021640143
-
Reliability in MOS integrated circuits
-
M. H. Woods and B. L. Euzent, “Reliability in MOS integrated circuits,” in IEDM Tech. Dig., p. 50, 1984.
-
(1984)
IEDM Tech. Dig.
, pp. 50
-
-
Woods, M.H.1
Euzent, B.L.2
-
2
-
-
0021292083
-
Predicting oxide failure rates using the matrix of a 64K DRAM chip
-
D. Wendell, D. Segers, and B. Wang, “Predicting oxide failure rates using the matrix of a 64K DRAM chip,” in Proc. Int. Reliability Physics Symp., p. 113, 1984.
-
(1984)
Proc. Int. Reliability Physics Symp.
, pp. 113
-
-
Wendell, D.1
Segers, D.2
Wang, B.3
-
3
-
-
84941504025
-
Electrical breakdown in thin gate and tunneling oxides
-
Feb.
-
I. C. Chen, S. E. Holland, and C. Hu, “Electrical breakdown in thin gate and tunneling oxides,” IEEE Trans. Electron Devices, vol. ED-32, no. 2, p. 413, Feb. 1985.
-
(1985)
IEEE Trans. Electron Devices
, vol.ED-32
, Issue.2
, pp. 413
-
-
Chen, I.C.1
Holland, S.E.2
Hu, C.3
-
4
-
-
0024170331
-
Projecting the minimum acceptable oxide thickness for time-dependent dielectric breakdown
-
R. Moazzami, J. Lee, I. C. Chen, and C. Hu, “Projecting the minimum acceptable oxide thickness for time-dependent dielectric breakdown,” in IEDM Tech. Dig., p. 710, 1988.
-
(1988)
IEDM Tech. Dig.
, pp. 710
-
-
Moazzami, R.1
Lee, J.2
Chen, I.C.3
Hu, C.4
-
5
-
-
0020822243
-
Leakage and breakdown in thin oxide capacitors—Correlation with decorated stacking faults
-
Sept.
-
P. S. D. Lin, R. B. Marcus, and T. T. Sheng, “Leakage and breakdown in thin oxide capacitors—Correlation with decorated stacking faults,” J. Electrochem. Soc., vol. 130, no. 9, p. 1878, Sept. 1983.
-
(1983)
J. Electrochem. Soc.
, vol.130
, Issue.9
, pp. 1878
-
-
Lin, P.S.D.1
Marcus, R.B.2
Sheng, T.T.3
-
6
-
-
0006331753
-
Stacking-fault-induced defect creation in SiO2 on Si(100)
-
May 30
-
M. Liehr, G. B. Bronner, and J. E. Lewis, “Stacking-fault-induced defect creation in SiO2 on Si(100),” Appl. Phys. Lett., vol. 52, no. 22, p. 1892, May 30, 1988.
-
(1988)
Appl. Phys. Lett.
, vol.52
, Issue.22
, pp. 1892
-
-
Liehr, M.1
Bronner, G.B.2
Lewis, J.E.3
-
7
-
-
0021471902
-
Breakdown in silicon oxides—Correlation with Cu precipitates
-
Aug. 1
-
K. Honda, A. Ohsawa, and N. Toyokura, “Breakdown in silicon oxides—Correlation with Cu precipitates,” Appl. Phys. Lett., vol. 45, no. 3, p. 270, Aug. 1, 1984.
-
(1984)
Appl. Phys. Lett.
, vol.45
, Issue.3
, pp. 270
-
-
Honda, K.1
Ohsawa, A.2
Toyokura, N.3
-
8
-
-
0000561824
-
Breakdown in silicon oxides (II)—Correlation with Fe precipitates
-
Mar. 15
-
K. Honda, A. Ohsawa, and N. Toyokura, “Breakdown in silicon oxides (II)—Correlation with Fe precipitates,” Appl. Phys. Lett., vol. 46, no. 6, p. 582, Mar. 15, 1985.
-
(1985)
Appl. Phys. Lett.
, vol.46
, Issue.6
, pp. 582
-
-
Honda, K.1
Ohsawa, A.2
Toyokura, N.3
-
9
-
-
36549092830
-
Impact of copper contamination on the quality of silicon oxides
-
Mar. 15
-
H. Wendt, H. Cerva, V. Lehmann, and W. Pamler, “Impact of copper contamination on the quality of silicon oxides,” J. Appl. Phys., vol. 65, no. 6, p. 2402, Mar. 15, 1989.
-
(1989)
J. Appl. Phys.
, vol.65
, Issue.6
, pp. 2402
-
-
Wendt, H.1
Cerva, H.2
Lehmann, V.3
Pamler, W.4
-
10
-
-
0024122432
-
Modeling and characterization of gate oxide reliability
-
Dec.
-
J. Lee, I. C. Chen, and C. Hu, “Modeling and characterization of gate oxide reliability,” IEEE Trans. Electron Devices, vol. 35, no. 12, p. 2268, Dec. 1988.
-
(1988)
IEEE Trans. Electron Devices
, vol.35
, Issue.12
, pp. 2268
-
-
Lee, J.1
Chen, I.C.2
Hu, C.3
-
11
-
-
0024766460
-
Temperature acceleration of time-dependent dielectric breakdown
-
Nov.
-
R. Moazzami, J. Lee, and C. Hu, “Temperature acceleration of time-dependent dielectric breakdown,” IEEE Trans. Electron Devices, vol. 36, no. 11, p. 2462, Nov. 1989.
-
(1989)
IEEE Trans. Electron Devices
, vol.36
, Issue.11
, pp. 2462
-
-
Moazzami, R.1
Lee, J.2
Hu, C.3
-
13
-
-
0003679027
-
-
New York, NY: McGraw-Hill
-
S. M. Sze, VLSI Technology. New York, NY: McGraw-Hill, 1983, p. 621.
-
(1983)
VLSI Technology
, pp. 621
-
-
Sze, S.M.1
-
14
-
-
0021305050
-
Characteristics and reliability of 100 A oxides
-
D. A. Baglee, “Characteristics and reliability of 100 A oxides,” in Proc. Int. Reliability Physics Symp., p. 152, 1984.
-
(1984)
Proc. Int. Reliability Physics Symp.
, pp. 152
-
-
Baglee, D.A.1
-
15
-
-
0016006161
-
Dielectric instability and breakdown in wide bandgap insulators
-
Jan./Feb.
-
T. H. DiStefano and M. Shatzkes, “Dielectric instability and breakdown in wide bandgap insulators,” J. Vac. Sci. Technol., vol. 12, no. 1, p. 37, Jan./Feb. 1975.
-
(1975)
J. Vac. Sci. Technol.
, vol.12
, Issue.1
, pp. 37
-
-
DiStefano, T.H.1
Shatzkes, M.2
-
16
-
-
0017960299
-
Dielectric breakdown in electrically stressed thin films of thermal SiO2
-
Apr.
-
E. Harari, “Dielectric breakdown in electrically stressed thin films of thermal SiO2,” J. Appl. Phys., vol. 49, no. 4, p. 2478, Apr. 1978.
-
(1978)
J. Appl. Phys.
, vol.49
, Issue.4
, pp. 2478
-
-
Harari, E.1
-
17
-
-
0347563098
-
Novel mechanism for tunneling and breakdown of thin SiO2 films
-
Nov. 7
-
B. Ricco, M. Ya. Azbel, and M. H. Brodsky, “Novel mechanism for tunneling and breakdown of thin SiO2 films,” Phys. Rev. Lett., vol. 51, no. 19, p. 1795, Nov. 7, 1983.
-
(1983)
Phys. Rev. Lett.
, vol.51
, Issue.19
, pp. 1795
-
-
Ricco, B.1
Azbel, M.Ya.2
Brodsky, M.H.3
-
18
-
-
0021477131
-
On physical models for gate oxide breakdown
-
Aug.
-
S. Holland, I. C. Chen, T. P. Ma, and C. Hu, “On physical models for gate oxide breakdown,” IEEE Electron Device Lett., vol. EDL-5, no. 8, p. 302, Aug. 1984.
-
(1984)
IEEE Electron Device Lett.
, vol.EDL-5
, Issue.8
, pp. 302
-
-
Holland, S.1
Chen, I.C.2
Ma, T.P.3
Hu, C.4
-
19
-
-
0022689456
-
Hole trapping and breakdown in thin SiO2
-
Mar.
-
I. C. Chen, S. Holland, and C. Hu, “Hole trapping and breakdown in thin SiO2,” IEEE Electron Device Lett., vol. EDL-7, no. 3, p. 164, Mar. 1986.
-
(1986)
IEEE Electron Device Lett.
, vol.EDL-7
, Issue.3
, pp. 164
-
-
Chen, I.C.1
Holland, S.2
Hu, C.3
-
20
-
-
36549102659
-
Substrate hole current and oxide breakdown
-
Sept. 15
-
I. C. Chen, S. Holland, K. K. Young, C. Chang, and C. Hu, “Substrate hole current and oxide breakdown,” Appl. Phys. Lett., vol. 49, no. 11, p. 669, Sept. 15, 1986.
-
(1986)
Appl. Phys. Lett.
, vol.49
, Issue.11
, pp. 669
-
-
Chen, I.C.1
Holland, S.2
Young, K.K.3
Chang, C.4
Hu, C.5
-
21
-
-
0022234920
-
A quantitative physical model for time-dependent breakdown in SiO2
-
I. C. Chen, S. Holland, and C. Hu, “A quantitative physical model for time-dependent breakdown in SiO2,” in Proc. Int. Reliability Physics Symp., p. 24, 1985.
-
(1985)
Proc. Int. Reliability Physics Symp.
, pp. 24
-
-
Chen, I.C.1
Holland, S.2
Hu, C.3
-
23
-
-
0022986875
-
Oxide breakdown dependence on thickness and hole current—Enhanced reliability of ultra thin oxides
-
I. C. Chen, S. Holland, and C. Hu, “Oxide breakdown dependence on thickness and hole current—Enhanced reliability of ultra thin oxides,” in IEDM Tech. Dig., p. 660, 1986.
-
(1986)
IEDM Tech. Dig.
, pp. 660
-
-
Chen, I.C.1
Holland, S.2
Hu, C.3
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