Evaluation of wire bond quality by SEM analysis of ball-shape and visual inspection of intermetallic formation

International Journal of Microcircuits and Electronic Packaging

Volumn 20, Issue 2, 1997, Pages 138-148

  Rooney, Daniel T ^a,b,c,d,e   Dixon, Jeffrey B ^a   Schurr, Kenneth G ^a   Northrup, Mark R ^a  

^a MOTOROLA INC   (United States)

^b Oneida Research Services Inc   (United States)

^c OFS   (United States)

^d SYRACUSE UNIVERSITY   (United States)

^e ALLEGHENY COLLEGE   (United States)

Author keywords

Automotive Electronics; Ball Bond Lift Technique; Ball Bond Visual Appearance; Failure Analysis; Grain Structure; Intermetallics; Metallurgy; Reliability; Wire Bond

Indexed keywords

EID: 0005195603     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Review

References (11)

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5. ASM Packaging Materials Handbook: Vol. 1, Packaging, pg. 472, 1989.
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10. H. Dowell, Texas Instruments Wire bonding Conference, Process Automation Center, Dallas, TX, 1994.
11. D. Rooney, et al. "Metal-Migration Failures in a Hybrid Device: Interaction of Package Materials, Process Residuals and Ambient Gases," Proceedings of the 1992 International Microelectronics Symposium, pg. 410, 1992.