The aluminum bond-pad corrosion in small outline packaged devices

Materials Chemistry and Physics

Volumn 48, Issue 1, 1997, Pages 27-35

  Ueng, H Y ^a   Liu, C Y ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Bond pad; Corrosion; Delamination; Molding compound

Indexed keywords

ALUMINUM CORROSION; DELAMINATION; EPOXY RESINS; FAILURE ANALYSIS; INTEGRATED CIRCUIT MANUFACTURE; MOISTURE; PLASTICS APPLICATIONS; RELIABILITY; SHEET MOLDING COMPOUNDS;

ALUMINUM BOND PADS; CROSS SECTION INSPECTION TEST; FLUORESCEIN INGRESS TEST;

ELECTRONICS PACKAGING;

EID: 0031099877     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(97)80072-7     Document Type: Article

References (21)

1. T. Raymond, Semiconductor Int., (Sep.) (1989) 152-159.
2. K.N. Ritz, W.T. Stacy and E.K. Broadbent, Proc. IEEE Int. Reliability Physics Symp., (1987) 28-33.
3. Syed Sajid Ahmad, R.C. Blish, T.J. Corbett, J.L. King and C.G. Shirley, IEEE Trans. Components Hybrids Manuf. Technol., 9 (4) (1986) 379-385.
4. G. DiGiacomo, Proc. Int. Rel. Phys. Technol., (1984) 223-228.
5. M. Yoshimaru and H. Matsuhasi, Proc. Int. Rel. Phys., (1987) 22-27.
6. R.R. Tummala and E.J. Rymaszewski, Microelectrics Packaging Handbook, Van Nostrand, New York, 1988, pp. 560-565.
7. M. Iannuzzi, IEEE Trans. Components Hybrids Manuf. Technol., 6 (2) (1983) 191-201.
8. J.J. Steppan, J.A. Roth, L.C. Hall, D.A. Jeannotte and S.P. Carbone, J. Electrochem. Soc., 134 (1987) 1175.
9. M. Pecht, IEEE Trans. Components Hybrids Manuf. Technol., 13, (2) (1990) 83-88.
10. Z.A. Forouls and M.J. Thubriikar, J. Electrochem. Soc., 122 (1975) 1296.
11. W.M. Paulson and R.P. Lorrigan, Proc. 14th Annu. Reliability Physics Symp., 1976, p. 42.
12. K.M. Striny and A.W. Schelling, Proc. Electronic Components Conf., 1981, p. 238.
13. G.M. Scamans and A.S. Rehal, J. Mater. Sci., 14 (1979) 2459.
14. L.T. Manzione, AT&T Plastic Packaging of Microelectronic Devices, Van Nostrand, New York, 1990, p. 180.
15. K. Van Doorselaer and K. De Zeeuw, IEEE Trans. Components Hybrids Manuf. Technol., 13 (4) (1990).
16. T. Adams and N.J. Lawrenceville, Semiconductor Int., (1990) 88-91.
17. R.R. Tummala and E.J. Rymaszewski, Microelectrics Packaging Handbook, Van Nostrand, New York, 1988, p. 639.
18. P.R. Engel, T. Corbett and W. Baerg, Proc. IEEE Int. Rel. Phys. Symp., (1983) 245-252.
19. M. Kitano, A. Nishimura and S. Kawai, Proc. IEEE Int. Rel. Phys. Symp., (1988) 90-95.
20. L.H. Van Vlack, Elements of Materials Science and Engineering, 1989, p. 535.
21. C.Y. Liu, Study on the aluminum bond-pad corrosion in plastic encapsulated IC package, Dissertation, National Sun Yat-sen University, Taiwan, 1991.