Plasma treatment for improved wire bonding

Solid State Technology

Volumn 39, Issue 10, 1996, Pages 117-120

  Fazlin, Fazal ^a,b,c,d,e,f  

^a Advanced Plasma Systems Inc   (United States)

^b UNIVERSITY OF KARACHI   (Pakistan)

^c Advanced Plasma Systems (APS)

^d APS Inc

^e Contr Data's Multilayer Technol C ^*

^f APS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); PLASMA APPLICATIONS; SURFACE CLEANING;

WIRE BONDING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0000358959     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (11)

1. A.S. Chen et al., "Wire Bonding: Present and Future Trends," IEEE/CHMT Intl. Elect. Manufact. Tech. Symp., pp. 45-51, 1993.
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3. J.L. Jellison "Effect of Surface Contamination on Solid Phase Welding - An Overview," "Surface Contamination Removal from Solid State Devices," Surface Contamination: Genesis, Detection, and Control, Vol. 2, Plenum Press, New York, NY, pp. 899-923, 1979.
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9. G.S. Ganesan, G. Lewis, H. Berg, "Characterizing Organic Contamination in IC Package Assembly," Intl. J. of Microcircuits and Elect. Pack., Vol. 17, No. 2, pp. 152-160, 1994.
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11. A. Grill, Cold Plasma in Materials Fabrication: From Fundamentals to Applications, IEEE Press, New York, NY, 1994.