Role of RIE in microchip bond pad corrosion

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 2874, Issue , 1996, Pages 95-102

  Brownson, Rickey ^a   Butler, Kevin ^a   Cadena, Sally ^a   Detar, Mark ^a   Johnson, Ivan ^a   McCoulloch, Lonnie ^a   McCoulloch, Jim ^a   Mishra, Brajendra ^a   Healey, Jerry T ^a   Honcik, Karen ^a   Phan, Tony T ^a   Sterif, Todd ^a   Stevens, H ^a   Tovar, Anita ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROCHIP BOND PADS; TITANIUM NITRIDE;

BONDING; CHEMISTRY; CORROSION; DEFECTS; ETCHING; SEMICONDUCTOR DEVICE MANUFACTURE; SPUTTERING; TITANIUM COMPOUNDS;

MICROELECTRONICS;

EID: 0030414835     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)