Fatigue crack propagation along polymer-metal interfaces in microelectronic packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 496-504

  Guzek, John ^a   Azimi, Hamid ^a   Suresh, Subra ^b  

^a INTEL CORPORATION   (United States)

^b Massachusetts Institute of Technology   (United States)

Author keywords

Delamination; Fatigue crack propagation; Interfaces; Microelectronic packaging

Indexed keywords

CRACK PROPAGATION; DELAMINATION; FATIGUE OF MATERIALS; FRACTURE MECHANICS; INTERFACES (MATERIALS); MICROELECTRONICS; ORGANIC POLYMERS; SCANNING ELECTRON MICROSCOPY; STRAIN RATE; STRESS INTENSITY FACTORS; SUBSTRATES; SURFACE ROUGHNESS;

DOUBLE CANTILEVER BEAM (DCB);

ELECTRONICS PACKAGING;

EID: 0031378917     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650940     Document Type: Article

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