Experimental study for reliability of electronic packaging under vibration

Experimental Mechanics

Volumn 36, Issue 4, 1996, Pages 339-344

  Ham, S J ^a   Lee, S B ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FATIGUE TESTING; LOADS (FORCES); RELIABILITY; SCADA SYSTEMS; VIBRATIONS (MECHANICAL);

FATIGUE LIFE;

ELECTRONICS PACKAGING;

EID: 0030394091     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02328576     Document Type: Article

References (6)

1. Constable, J.H. and Sahay, C., "Electrical Resistance as an Indicator of Fatigue," IEEE Trans. CHMT, 15 (6), 1138-1145 (1992).
2. Constable, H., "Use of Interconnect Resistance as a Reliability Tool," Proc. 44th Electronic Components & Technology Conference (May 1994).
3. Engel, P.A. and Miller, T.M., "Torsional Stiffness and Fatigue Study of Surface-mounted Compliant Leaded System," IEEE Trans. CHMT, 16 (6), 577-583 (1993).
4. Engel, P.A. and Westby, G., "Circuit Board Torsion Analysis by Computational and Electrical Resistance Measurement Methods," EEP-Vol. 4-1, Advances in Electronic Packaging, 113, 129-137 (1993).
5. Lau, J. and Erasmus, S., "Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints under Bending, Twisting, and Thermal Conditions," ASME J. Electronic Packaging, 115, 322-328 (1993).
6. Dally, J.W. and Riley, W.F., Experimental Stress Analysis, 2nd ed., McGraw-Hill, New York (1978).