Calibration of resistance type die level temperature sensors using a single temperature technique

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 40-46

  Solbrekken, Gary L ^a   Chiu, Chia Pin ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALIBRATION; DIES; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; ERROR ANALYSIS; HEAT RESISTANCE; SENSORS; THERMOANALYSIS;

DIE LEVEL TEMPERATURE SENSORS; SINGLE TEMPERATURE TECHNIQUES;

MICROPROCESSOR CHIPS;

EID: 0033902296     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833040     Document Type: Article

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