Development and application of test chips and test systems for the thermal characteristics of IC packaging technologies

Proceedings - IEEE Semiconductor Thermal and Temperature Measurement Symposium

Volumn , Issue , 1992, Pages 47-54

  Mathuna, Sean Cian O ^a   Liu, Daguang ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT TESTING; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS;

COMPUTERIZED TEST SYSTEMS; IC PACKAGING TECHNOLOGIES; TEST CHIPS; THERMAL CHARACTERISTICS;

ELECTRONICS PACKAGING;

EID: 0026815673     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)