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Volumn , Issue , 1995, Pages 102-114
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Comparative thermal evaluations of small surface mount flat packs
a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
ENERGY DISSIPATION;
HEAT RESISTANCE;
HEAT SINKS;
INTEGRATED CIRCUIT MANUFACTURE;
PERFORMANCE;
PLATE METAL;
SPREADERS;
THERMOANALYSIS;
THERMODYNAMIC PROPERTIES;
ALUMINUM PLATES;
HEAT SPREADER;
METAL QUAD FLAT PACK;
PLASTIC QUAD FLAT PACK;
POWER DISSIPATION;
SURFACE MOUNT FLAT PACKS;
SURFACE MOUNT TECHNOLOGY;
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EID: 0029462474
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (2)
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References (14)
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