THERMAL RESISTANCE OF IC PACKAGES.

Electronic Packaging and Production

Volumn 14, Issue 6, 1974, Pages

  Roughan, P E ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE;

INTEGRATED CIRCUITS;

EID: 0016069277     PISSN: 00134945     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (0)