Thermal Chip Evaluation of IC Packaging

IEEE Transactions on Parts, Hybrids, and Packaging

Volumn 8, Issue 3, 1972, Pages 39-44

  Mclaughlin, M H ^a   Fitzroy, Nancy D ^a  

^a GENERAL ELECTRIC COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 78049512876     PISSN: 03611000     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPHP.1972.1136572     Document Type: Article

References (4)

1. N. G. Daniels, pt. 1, “Heat transfer and integrated circuits,” Electro-Technol., vol. 83, Jan. 1969.
2. M. H. McLaughlin and N. D. Fitzroy, “Therrnal chip method for investigation of IC chip bonding,” General Electric Co., T.I.S. Rep. 71-C-090, May 1971.
3. H. Raillard, “Heat flow and thermal properties of selenium-arsenide junction lasers,” General Electric Co., T.I.S. Rep. R65ELS-4, 1965.
4. S. E. Scrupski, “IC's on film strip lend themselves to automatic handling by manufacturer and user, too,” Electronics, vol. 44, pp. 44-48, Feb. 1, 1971.