Pattern dependent modeling for CMP optimization and control

Materials Research Society Symposium - Proceedings

Volumn 566, Issue , 1999, Pages 197-209

  Boning, D ^a   Lee, B ^a   Oji, C ^a   Ouma, D ^a   Park, T ^a   Smith, T ^a   Tugbawa, T ^a  

^a Massachusetts Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DENSITY (SPECIFIC GRAVITY); MATHEMATICAL MODELS; OPTIMIZATION; OXIDES; PROCESS CONTROL;

DENSITY DEPENDENT EFFECTS; PATTERN DEPENDENT CHEMICAL MECHANICAL MODELING; SHALLOW TRENCH ISOLATION POLISH; STEP HEIGHT LIMITS;

CHEMICAL POLISHING;

EID: 0033745866     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-566-197     Document Type: Article

References (20)

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