Tuning fork silicon angular rate sensor with enhanced performance for automotive applications

Sensors and Actuators, A: Physical

Volumn 83, Issue 1, 2000, Pages 80-84

  Sassen, S ^a   Voss, R ^a   Schalk, J ^a   Stenzel, E ^a   Gleissner, T ^a   Gruenberger, R ^a   Neubauer, F ^a   Ficker, W ^a   Kupke, W ^a   Bauer, K ^a   Rose, M ^b  

^a DAIMLER AG   (Germany)

^b TEMIC   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE ENGINEERING; ELECTRODES; GYROSCOPES; MICROMACHINING; OSCILLATIONS; PIEZOELECTRICITY; SHEAR STRESS; SILICON WAFERS; TORQUE;

TUNING FORK ANGULAR RATE SENSOR;

MICROSENSORS;

EID: 0033733073     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(00)00291-0     Document Type: Article

References (27)

1. H. Kong, E. Wallner, Automotive rollover angular rate sensors and evaluation, SAE Technical Paper #1999-01-0430, Detroit, 1999.
2. P. Steiner, P. Weidel, H. Kübleck, H. Steurer, P. Hora, D. Zechmair, Rollover detection, SAE Technical Paper #970606, 1997.
3. Reppich A., Willig R. Yaw rate sensor for vehicle dynamics control system. Proc. SAE Detroit. 1995;67-76.
4. Johnson J., Zarabadi S., Sparks R. Surface micromachined angular rate sensor. Proc. SAE Detroit. 1995;77-83.
5. Söderqist J. Micromachine gyroscopes. Sens. Actuators, A. 43:1994;65-71.
6. N. Barbour, Micromechanical silicon instrument and systems development at Draper Laboratory, AIAA Guidance Navigation and Control Conf., San Diego, CA, AIAA Paper 96-3709 (A96-35593), 1996.
7. Voss R. Silicon micromachined vibrating gyroscopes. Proc. SPIE 1997, Symp. of Micromachining and Microfabrication, Austin. 1997.
8. Voss R., Bauer K., Ficker W., Gleissner T., Kupke W., Rose M., Sassen S., Schalk J., Seidel H., Stenzel E. Silicon angular rate sensor for automotive applications with piezoelctric drive and piezoresistive read-out. Transducers '97, Chicago, USA. 1997;879-882.
9. R. Hilser, R. Ernst, J. Schnell, R. Wolpert, J. Söderqist, Angular rate sensor based on single-ended quartz tuning fork, SAE Technical Paper #1999-01-1038, Detroit, 1999.
10. Bernstein J., Cho S., King A., Kourepenis A., Maciel P., Weinberg M. A micromachined comb-drive tuning fork rate gyroscope. Proc. IEEE Micro Electro Mechanical Systems, Fort Lauderdale, FL. 1993;143-148.
11. M.-A. Paoletti, N.F. Grytillat, D. de Rooij, A silicon micromachined vibrating gyroscope with piezoresistive detection and electromagnetic excitation, Proc. MEMS 96, San Diego, CA, pp. 162-167.
12. T. Ichinose,Y. Ishiai, M. Hatanaka, J. Yukawa, S. Kawasaki, T. Uemura, Quartz angular rate sensor for automotive application, SAE Technical Paper #1999-01-0934, Detroit, 1999.
13. G.I. Andersson, N. Hedenstierna, P. Svensson, H. Pettersson, A novel silicon bulk gyroscope, Proc. Transducers 99, Sendai, Japan, pp. 902-905.
14. A. Thomae, R. Schellin, M. Lang, W. Bauer, J. Mohaupt, G. Bischhopink, L. Tanten, H. Baumann, H. Emmerich, S. Pinter, J. Marek, K. Funk, G. Lorenz, R. Neul, A low-cost angular rate sensor in Si-surface micromachining technology for automotive application, SAE Technical Paper #1999-01-0931, Detroit, 1999.
15. Ljung P.B., Juneau T., Pisano A.P. Micromachined two input axis angular rate sensor. ASME Int. Mechanical Engineering Congress and Exposition, session DSC-16 IMECE. Vol. 57-2:1995;957-962.
16. T. Fujita, K. Hatano, K. Maenaka, T. Mizuno, T. Matsuoka, T. Kojima, T. Oshima, M. Maeda, Vacuum sealed silicon bulk micromachined gyroscope, Proc. Transducers 99, Sendai, Japan, pp. 914-917.
17. P. Greiff, B. Boxenhorn, T. King, L. Nilsen, Silicon monolithic micromechanical gyroscope, Proc. Transducers 91, San Francisco, USA, pp. 966-968.
18. Maenaka K., Konishi Y., Fujita T., Maeda M. Analysis and design concept of highly sensitive silicon gyroscope. Technical Digest of the 13th Sensor Symposium. 1995;612-615.
19. B. Sulouff, Integrated surface micromachined gyro and accelerometers for automotive sensor applications, Advanced Microsystems for Automotive Applications 99, Berlin, pp. 261-270.
20. J. Marek, Overview of Silicon Sensors for Automotive Applications Advanced Microsystems for Automotive Applications, Berlin, Germany, 1996.
21. Putty M.W., Najafi K. A micromachined vibrating ring gyroscope. Proc. Solid-State Sensor and Actuator Workshop, Hilton Head, SC. 1995;213-220.
22. S. Zarabadi, T. Vas, D. Sparks, J. Johnsen, Q. Jiang, M. Chia, E. Borzabadi et al., A resonating comb/ring angular rate sensor vacuum packaged via wafer bonding, SAE Technical Paper #1999-01-1043, Detroit, 1999.
23. Kanda Y. Optimum design considerations for silicon pressure sensors using a four-terminal gauge. Sens. Actuators. 4:1983;199-206.
24. Lasky J.B. Wafer bonding for silicon-on-insulator technologies. Appl. Phys. Lett. 48:1986;78-80.
25. Okano H., Takahashi Y., Tanaka T., Shibata K., Nakano S. Preparation of c-axis oriented AlN thin films by low-temperature reactive sputtering. Jpn. J. Appl. Phys. 31:1992;3446-3451.
26. Seidel H., Fritsch U., Gottinger R., Schuster G., Nothelfer U., Riedel H., Kupke W., Voß R. Piezoresistive silicon accelerometer for automotive applications. Proceedings Sensor Messe, Nürnberg, Germany:1993.
27. H. Seidel, U. Fritsch, R. Gottinger, J. Schalk, A piezoresistive silicon accelerometer with monolithically integrated CEMOS-circuitry, Transducers 95, Stockholm, Sweden, pp. 597-600.