A resonating comb/ring angular rate sensor vacuum packaged via wafer bonding

SAE Technical Papers

Volumn , Issue , 1999, Pages

  Zarabadi, S ^a   Vas, T ^a   Sparks, D ^a   Johnson, J ^a   Jiang, Q ^a   Chia, M ^a   Borzabadi, E ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; ELECTRONICS PACKAGING; SILICON WAFERS;

ANGULAR RATE SENSORS; AUTOMOTIVE APPLICATIONS; BULK SILICON ETCHING; LOW-COST SENSORS; MICRO-MACHINED; TEMPERATURE PERFORMANCE; WAFER LEVEL PACKAGING; WAFER TO WAFER BONDING;

WAFER BONDING;

EID: 85072409923     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/1999-01-1043     Document Type: Conference Paper

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