Advanced flip chip bonding techniques using transferred microsolder bumps

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 2, 2000, Pages 399-404

  Koshoubu, Nobutatsu ^a   Ishizawa, Suzuko ^a   Tsunetsugu, Hideki ^a   Takahara, Hideyuki ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FLIP CHIP DEVICES; INTEGRATED OPTOELECTRONICS; MULTICHIP MODULES; OPTICAL COMMUNICATION; SOLDERING;

MICROELECTRIC PACKAGING; OPTICAL ALIGNMENT; SELF ALIGNMENT; SOLDER BUMP;

ELECTRONICS PACKAGING;

EID: 0033717687     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.846781     Document Type: Article

References (7)

1. S. Koike, S. Matsui, and H. TakaharaEaser diode array packaging for coupling to optical polyimide waveguides in optoelectronic multichip modules,"; in Proc. 45th Electron. Comp. Technol. Conf., May 1995, pp. 766-769.
2. K.J. Puttlitz, K. A. Eidestri, and P. A. TottaSolder transfer technique for flip chip and electronic assembly application,"; in Proc. 46th Electron. Comp. Technol. Conf., May 1996, pp. 559-564.
3. H. Tsunetsugu et al., ";A new packaging technology using microsolder bumps for high-speed photoreceivers,"; IEEE Trans. Comp. Packag., Manufact. Technol. B, vol. 15, pp. 578-582, Aug. 1992.
4. H. Tsunetsugu et al., ";A packaging technique for an optical 90°-hybrid balanced receiver using a planar lightwave circuit,"; IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 19, pp. 327-334, Aug. 1993.
5. Y. Kato et al., ";Solder bump froming using micro punching technology,"; in Proc.IEEE CPMT Soc. 1995 Jpn. IEMT Symp., Omiya, Japan, Dec. 4-6, 1995, pp. 117-120.
6. H. Tsunetsugu et al., ";Flip chip bonding technique using transferred microsolder bumps,"; IEEE Trans. Comp., Packag., Manufact. Technol. C, vol. 20, pp. 327-334, Oct. 1997.
7. H. Tsunetsugu, T. Hayashi, K. Katsura, M. Hosoya, N. Sato, and N. KukutsuAccurate, stable, high-speed interconnections using 20- to 30-μm-diameter microsolder bumps,"; IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 20, pp. 76-82, Mar. 1997.