Solder bump forming using micro punching technology

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 117-120

  Kato, Yoshimasa ^a   Ueoka, Yosihito ^a   Kono, Eiichi ^a   Hagimoto, Eiji ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; PUNCHING; SOLDERING ALLOYS; SUBSTRATES;

FLIP CHIP INTERCONNECTION; MICRO PUNCHING TECHNOLOGY; SOLDER BUMP FORMING METHOD; SOLDER MATERIAL; TRANSFERRING METHOD;

SOLDERING;

EID: 0029459051     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)