A New Packaging Technology Using Microsolder Bumps for High-Speed Photoreceivers

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 15, Issue 4, 1992, Pages 578-582

  Hata, Susumu ^a   Katsura, Kohsuke ^a   Hayashi, Tsuyoshi ^a   Ishitsuka, Fuminori ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; IMPEDANCE MATCHING (ELECTRIC); OPTICAL FIBER COUPLING; PHOTODETECTORS; SOLDERED JOINTS;

MICROSOLDER BUMPS; OPTOELECTRONICS PACKAGING; PHOTORECEIVERS; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 0026907842     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.159888     Document Type: Article

References (7)

1. N. Takachio et al., “A 10 GB/s optical heterodyne detection experiment using a 23 GHz bandwidth balanced receiver,” in Proc. MTT-S, 1990.
2. R. S. Sussman et al., “Ultra-low-capacitance flip-chip-bonded GaInAs PIN photodetector for long-wavelength high-data-rate fiber-optic systems,” Electron. Lett., vol. 21, no. 14, pp. 593–595, 1985.
3. K. Katsura et al., “A novel flip-chip interconnection technique using solder bumps for high-speed photoreceivers,” J. Lightwave Technol., vol. 8, no. 9, Sept. 1990.
4. K. Katsura et al., “A micro interconnection technique using solder bumps for high-speed optical devices,” in Proc. 6th Int. Microelectronics Conf., 1990, pp. 105–108.
5. H. Tomimuro et al., “A new packaging technology for GaAs MMIC modules,” in IEEE GaAs Symp. Tech. Dig., Nov. 1989, pp. 307–310.
6. J. E. Bowers, C. A. Burrus, and R. J. McCoy, “InGaAs PIN photodetectors with modulation response to millimeter wavelengths,” Electron. Lett., vol. 21, no. 18, pp. 812–814, 1985.
7. N. Takachio, K. Iwashita, S. Hata, K. Onodera, K. Katsura, and H. Kikuchi, “A 10 Gb/s optical heterodyne detection experiment using a 23 GHz bandwidth balanced receiver,” IEEE Trans. Microwave Theory Techn., vol. 38, Dec. 1990.